Project Overview
I held end-to-end technical ownership of the Digi XBee-LR wireless communications module — a long-range, low-power Sub-GHz LoRaWAN® RF platform designed for OEM sensor and IoT products.
The system enables globally deployable device-to-cloud connectivity with zero-touch provisioning, reducing integration friction for OEM customers while meeting stringent regulatory and power constraints. My responsibility spanned system architecture and execution, including RF and hardware design, embedded firmware, provisioning workflows, developer tooling, compliance certification, and production readiness at Digi International.
The Digi XBee-LR platform integrates cleanly into embedded designs and supports reliable LoRaWAN networking across industrial IoT, smart infrastructure, agriculture, and asset-tracking deployments at scale.
References
Official Product Page: https://www.digi.com/products/embedded-systems/digi-x-on/digi-xbee-lr-for-lorawan
Datasheet: https://www.digi.com/resources/library/data-sheets/digi-xbee-lr-datasheet
Impact & Outcomes
Enabled OEM customers to deploy certified long-range LoRaWAN products without in-house RF expertise
Reduced time-to-market through modular certification (FCC, IC, CE) and reusable reference designs
Delivered zero-touch provisioning workflows that simplified large-scale field deployments
Established a scalable platform foundation for Digi’s long-range IoT and cloud-connected device portfolio
Technical Scope & Ownership
System architecture across RF, embedded firmware, and cloud provisioning
Sub-GHz long-range RF and regional band support
Embedded firmware architecture, low-power operation, and OTA update paths
Digi X-ON IoT platform integration and Digi XBee Studio tooling
FCC, IC, and CE modular compliance and certification
OEM integration support, developer documentation, and user guides